Paper
Non-Contact Temperature Measurements Using Thermocouple Placed in Hole in High-Temperature Subjects
- Authors:
- Katsuaki Shirai; Tsuyoshi Kawanami; Hiroyuki Ageishi; Shigeki Hirasawa
- Abstract
- New devices using non-contact temperature measurements for high-temperature subjects are needed for manufacturing processes. We analytically and experimentally studied the measurement error of a non-contact temperature measurement method using a thermocouple placed in a hole in a subject. Radiation heat transfer and thermal conduction for the thermocouple placed in the hole were calculated. We found that the measurement error of a non-contact temperature measurement method using a thermocouple placed in a hole of a 1000°C subject was much lower than the measuring error of simple method using a thermocouple placed near a subject. The measuring error was less than 1°C when the thermocouple in the hole was longer than 22 mm, or the diameter of the thermocouple was less than 0.15 mm. Steady temperature was measured by an experimental apparatus similar to the calculation model. Experimental results agreed with calculations.
- Keywords
- Non-contact Temperature Measurement; Accuracy; Manufacturing Process; Heat Transfer
- StartPage
- 17
- EndPage
- 22
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